Please use this identifier to cite or link to this item:
http://repository.psa.edu.my/handle/123456789/1450Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.date.accessioned | 2019-02-26T06:18:57Z | - |
| dc.date.available | 2019-02-26T06:18:57Z | - |
| dc.date.issued | 2013-10-21 | - |
| dc.identifier.uri | http://repository.psa.edu.my/handle/123456789/1450 | - |
| dc.title | EE503 : INTEGRATED CIRCUIT FABRICATION AND PACKAGING TECHNOLOGY | en_US |
| Appears in Collections: | Electrical Engineering Department | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| EE503 INTEGRATED CIRCUIT FABRICATION AND PACKAGING TECHNOLOGY (SESI JUN 2013).pdf | 1.62 MB | Adobe PDF | View/Open |
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