MACHINE PROCESS CONDITION MONITORING WITH 3MP

dc.contributor.author	MAZNAH ILLIYAS AHMAD
dc.contributor.author	YUSRI YUSOF
dc.contributor.author	ANBIA ADAM
dc.contributor.author	MOHD ELIAS DAUD
dc.date.accessioned	2020-12-31T15:30:18Z
dc.date.available	2020-12-31T15:30:18Z
dc.date.issued	2019
dc.identifier.uri	http://repository.psa.edu.my/handle/123456789/2444
dc.description.abstract	Recently, machine process domain is archiving significant advancement in term of sensing technology. The technology has a powerful impact on enabling self -monitoring and results in high quality of final product. The aim of this paper is to propose a new method on machine process condition monitoring by 3MP. 3MP (Modern Machine Monitoring Process) works wirelessly to integrate between machine, computer and 6 type of sensory device.	en_US
dc.language.iso	en	en_US
dc.publisher	IEEE	en_US
dc.subject	Machining process	en_US
dc.subject	Condition monitoring	en_US
dc.subject	WSN	en_US
dc.subject	sensor	en_US
dc.title	MACHINE PROCESS CONDITION MONITORING WITH 3MP	en_US
dc.type	Article	en_US